Molybdenum Copper Plate

• High thermal conductivity for heat dissipation

• Low coefficient of thermal expansion

• Excellent dimensional stability

• Good thermal cycling performance

• High thermal management capability

• Suitable for semiconductor and electronic packaging

• Good machinability with appropriate processing

• Available in different Mo-Cu compositions

• Custom plate dimensions and thicknesses may be available

• Material documentation and COA available as applicable

Property	Typical Information
Product Name	Molybdenum Copper Plate
Chemical Composition	Molybdenum (Mo) and Copper (Cu)
Common Grades	MoCu10, MoCu15, MoCu20, MoCu25, MoCu30, MoCu40
Molybdenum Content	Approximately 60%–90%
Copper Content	Approximately 10%–40%
Density	Approximately 9.5–10.2 g/cm³
Thermal Conductivity	Approximately 160–250 W/m·K
Coefficient of Thermal Expansion	Approximately 5–9 × 10⁻⁶/K
Electrical Conductivity	Composition-dependent
Melting Point	Composition-dependent; copper melts at approximately 1,085°C and molybdenum at approximately 2,623°C
Appearance	Silver-gray to copper-gray
Material Structure	Molybdenum-copper composite
Machinability	Good with suitable machining methods
Applications	Thermal management and electronic packaging

• MoCu10 Plate – High copper content for improved thermal conductivity

• MoCu15 Plate – Thermal management and electronic packaging

• MoCu20 Plate – Balanced thermal conductivity and thermal expansion

• MoCu25 Plate – Electronic and semiconductor components

• MoCu30 Plate – Low-expansion thermal management applications

• MoCu40 Plate – Higher molybdenum content for reduced thermal expansion

• High-Purity Molybdenum Copper Plate

• Custom Mo-Cu Composite Plate

1. What is a molybdenum copper plate?

A molybdenum copper plate is a composite material made by combining molybdenum and copper to provide a balance of thermal conductivity, low thermal expansion, and dimensional stability.

2. What is molybdenum copper plate used for?

Common applications include semiconductor packaging, heat spreaders, power electronics, microwave devices, RF components, and thermal management systems.

3. What is the difference between MoCu10 and MoCu30?

The numbers generally indicate the nominal copper content by weight. MoCu10 contains approximately 10% copper and 90% molybdenum, while MoCu30 contains approximately 30% copper and 70% molybdenum. Higher copper content generally increases thermal conductivity and thermal expansion.

4. Does molybdenum copper have high thermal conductivity?

Yes. MoCu composites offer good thermal conductivity, although the exact value depends on composition, density, and manufacturing method.

5. Can molybdenum copper plates be machined?

Yes. MoCu plates can be machined into components such as heat spreaders, electronic substrates, and precision mounting plates using suitable tooling and machining processes.

6. Can REG Metals supply custom molybdenum copper plates?

REG Metals can source MoCu plates subject to availability and specification. Customers should provide the required composition, dimensions, thickness, flatness, tolerances, surface finish, and quantity when requesting a quotation.