REG Metals supplies Nickel Copper Sputtering Targets (Ni-Cu Targets) for physical vapor deposition (PVD), magnetron sputtering, semiconductor research, electronic thin films, magnetic materials, corrosion-resistant coatings, sensors, optical research, and advanced materials development.
Nickel-Copper (Ni-Cu) is an alloy system combining nickel’s corrosion resistance and thermal stability with copper’s excellent electrical and thermal conductivity. By controlling the Ni/Cu ratio, sputtering targets can be tailored for deposition of composition-controlled Ni-Cu alloy thin films used in electronic, magnetic, catalytic, and functional coating applications.
REG Metals supplies Ni-Cu targets in nickel-rich, copper-rich, and custom compositions, including commonly requested ratios such as Ni70Cu30, Ni50Cu50, Ni30Cu70, and other customer-specified chemistries. Compositions can be specified in either weight percent (wt.%) or atomic percent (at.%).
Targets are available in round, rectangular, square, planar, and custom geometries. Backing-plate bonding may be available depending on target dimensions and sputtering-system requirements. Material can be supplied with Certificate of Analysis (COA), composition data, dimensional inspection, impurity analysis, and lot traceability.
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