Osmium Sputtering Target

High Purity Osmium

• Purity up to 99.99% or customer specification
• Controlled trace metallic impurities
• Suitable for advanced thin-film deposition
• COA available

High Temperature Performance

• Melting point of approximately 3,033°C
• Excellent thermal stability
• Suitable for specialized high-temperature materials research

Precision Target Manufacturing

• Custom diameters and thicknesses
• Round and rectangular configurations
• Precision-machined surfaces
• Customer drawings accepted

Target Bonding Options

• Unbonded targets
• Bonded targets upon request
• Copper backing plates
• Custom backing plate configurations

Property	Specification / Typical Value
Product Name	Osmium Sputtering Target
Chemical Symbol	Os
CAS Number	7440-04-2
Atomic Number	76
Atomic Weight	Approx. 190.23
Material Type	Platinum Group Metal (PGM)
Purity	99.9%, 99.95%, 99.99% or Custom
Appearance	Bluish-Gray / Silver-Gray Metallic
Density	Approx. 22.59 g/cm³
Melting Point	Approx. 3,033°C
Boiling Point	Approx. 5,000°C
Crystal Structure	Hexagonal Close-Packed (HCP)
Target Shape	Round, Disc, Rectangular, Custom
Surface	Machined / Finished
Bonding	Available Upon Request
Certification	COA Available

• 99.9% Osmium Sputtering Target
• 99.95% Osmium Sputtering Target
• 99.99% High Purity Osmium Target
• Research Grade Osmium Target
• Thin-Film Deposition Grade Osmium Target
• Custom Purity Osmium Targets

1. What is an Osmium Sputtering Target?

An Osmium Sputtering Target is a high-purity solid osmium source material used in sputtering and PVD systems to deposit thin osmium or osmium-containing films onto substrates.

2. What purity levels are available?

REG Metals supplies:

• 99.9% Os
• 99.95% Os
• 99.99% Os

Higher or custom purity requirements may be available upon request.

3. What sizes are available for Osmium Sputtering Targets?

Standard and custom sizes are available, including 1-inch, 2-inch, 3-inch, and 4-inch diameter targets with customer-specified thicknesses. Availability depends on the required purity and geometry.

4. Can Osmium Targets be bonded to a backing plate?

Yes. Bonded configurations may be available depending on target dimensions and sputtering system requirements. Copper and customer-specified backing plates can be quoted upon request.

5. What information should I provide when requesting a quote?

For the fastest quotation, provide the purity, diameter or length and width, thickness, quantity, backing plate requirements, bonding requirements, and any applicable drawing or specification.

6. Does REG Metals provide certification?

Yes. REG Metals can provide Certificate of Analysis (COA), chemical composition data, purity documentation, dimensional inspection, and lot traceability as applicable to the order.