Oxygen-Free Copper (Cu) Foil/Tape is a high-purity copper material manufactured with extremely low oxygen content for applications requiring excellent electrical conductivity, thermal conductivity, ductility, corrosion resistance, and purity. Also known as Oxygen-Free Copper Foil, OFC Copper Foil, OFHC Copper Foil, Oxygen-Free Copper Tape, OFC Copper Tape, Cu Foil, and High-Purity Copper Foil, it is available in various thicknesses, widths, tempers, and surface finishes.
REG Metals can source oxygen-free copper foil and tape with controlled copper purity, oxygen content, thickness, width, electrical conductivity, surface roughness, and mechanical properties for electronics, electrical, thermal, vacuum, semiconductor, and specialty applications.
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