Ruthenium Sputtering Target

• High-purity Ruthenium Sputtering Target
• Ru Sputtering Target
• Ruthenium Metal Sputtering Target
• Ruthenium PVD Target
• Excellent chemical stability
• Excellent corrosion resistance
• High electrical conductivity
• High thermal stability
• High melting point
• Excellent wear resistance
• Excellent film adhesion
• Dense target structure
• Low porosity
• Low impurity levels
• Consistent sputtering performance
• Suitable for DC sputtering
• Suitable for RF sputtering
• Suitable for PVD thin-film deposition
• Suitable for semiconductor applications
• Suitable for advanced electronics
• Suitable for memory and data-storage research
• Suitable for sensors
• Suitable for electrodes
• Suitable for conductive thin films
• Suitable for barrier and seed-layer research
• Suitable for optical and specialty coatings
• High-density targets available
• Bonded and unbonded options
• Custom dimensions available
• COA available

Property	Specification
Product Name	Ruthenium Sputtering Target
Material	Ruthenium
Chemical Symbol	Ru
Atomic Number	44
CAS Number	7440-18-8
Material Type	Platinum Group Metal
Purity	99.9%, 99.95%, 99.99%, 99.999%
Appearance	Silvery-Gray Metallic
Crystal Structure	Hexagonal Close-Packed
Density	~12.45 g/cm³
Melting Point	~2,334°C
Electrical Conductivity	High
Target Type	Planar / Circular / Rectangular / Custom
Diameter	Custom
Length	Custom
Width	Custom
Thickness	Custom
Density	High-Density / Custom
Bonding	Bonded / Unbonded
Backing Plate	Cu / Mo / Custom
Surface Finish	Sputter-Ready / Machined / Custom
Grain Structure	Fine Grain / Custom
Packaging	Protective / Vacuum / Custom

• 99.9% Ruthenium Sputtering Target
• 99.95% Ruthenium Sputtering Target
• 99.99% High-Purity Ruthenium Sputtering Target
• 99.999% Ultra-High-Purity Ruthenium Target
• Pure Ruthenium Sputtering Target
• High-Purity Ru Target
• Ruthenium Metal PVD Target
• Ruthenium DC Sputtering Target
• Ruthenium RF Sputtering Target
• Semiconductor-Grade Ruthenium Target
• Electronics-Grade Ruthenium Target
• Thin-Film Grade Ruthenium Target
• Research-Grade Ruthenium Target
• High-Density Ruthenium Target
• Fine-Grain Ruthenium Target
• Bonded Ruthenium Sputtering Target
• Unbonded Ruthenium Sputtering Target
• Copper-Backed Ruthenium Target
• Molybdenum-Backed Ruthenium Target
• Custom Ruthenium Sputtering Target

1. What is a Ruthenium Sputtering Target?

A Ruthenium Sputtering Target is a high-purity ruthenium metal source used in PVD sputtering systems to deposit ruthenium thin films and ruthenium-based coatings onto substrates.

2. What is Ruthenium Sputtering Target used for?

Applications include semiconductor manufacturing, electronics, data storage, sensors, electrodes, conductive thin films, barrier layers, seed layers, and advanced materials research.

3. Can Ruthenium Targets be used for DC sputtering?

Yes. Metallic ruthenium is electrically conductive and can generally be used with DC sputtering systems, subject to the equipment and process configuration.

4. Can Ruthenium Targets be used for RF sputtering?

Yes. RF sputtering can also be used depending on the deposition system and desired film characteristics.

5. What purity levels are available?

Common grades include 99.9%, 99.95%, 99.99%, and 99.999% ruthenium, with customized trace-element specifications available.

6. What target shapes are available?

REG Metals can source circular, rectangular, planar, and custom-shaped ruthenium sputtering targets.