Aluminum Scandium Sputtering Target

• High-purity Aluminum Scandium Sputtering Target
• AlSc Sputtering Target
• Aluminum-Scandium Alloy Sputtering Target
• Al-Sc Sputtering Target
• Aluminum Scandium Metal Target
• High-purity aluminum alloy
• Controlled scandium concentration
• Homogeneous Al-Sc composition
• Low impurity levels
• Excellent sputtering stability
• Uniform deposition
• Suitable for AlScN thin-film deposition
• Suitable for RF sputtering
• Suitable for DC sputtering
• Suitable for magnetron sputtering
• Suitable for reactive sputtering
• Suitable for PVD
• Suitable for piezoelectric thin films
• Suitable for MEMS devices
• Suitable for RF filters
• Suitable for 5G and 6G communication components
• Suitable for BAW resonators
• Suitable for acoustic resonators
• Suitable for sensors and actuators
• Suitable for semiconductor research
• Custom Sc concentration
• High-density targets available
• Bonded and unbonded options
• Copper or molybdenum backing plates
• Custom target dimensions
• COA available

Property	Specification
Product Name	Aluminum Scandium Sputtering Target
Common Name	AlSc / Al-Sc Target
Material	Aluminum-Scandium Alloy
Primary Elements	Al + Sc
Scandium Content	Custom; commonly 1–40 at.%
Aluminum Content	Balance
Purity	99.5%, 99.9%, 99.95%, 99.99%, Custom
Appearance	Metallic Gray / Silver
Material Type	Metal Alloy
Density	Composition Dependent
Target Shape	Circular / Rectangular / Custom
Diameter	Custom
Length	Custom
Width	Custom
Thickness	Custom
Grain Structure	Fine / Controlled
Sputtering Method	DC / RF / Magnetron / Reactive
Target Density	High-Density / Custom
Bonding	Bonded / Unbonded
Backing Plate	Cu / Mo / Custom
Surface Finish	Machined / Ground / Sputter-Ready
Packaging	Protective / Vacuum / Custom

• AlSc Sputtering Target
• Aluminum Scandium Sputtering Target
• Al-Sc Alloy Sputtering Target
• Aluminum Scandium Metal Target
• High-Purity AlSc Target
• 99.9% Aluminum Scandium Target
• 99.99% Aluminum Scandium Target
• Al-1Sc Sputtering Target
• Al-5Sc Sputtering Target
• Al-10Sc Sputtering Target
• Al-15Sc Sputtering Target
• Al-20Sc Sputtering Target
• Al-25Sc Sputtering Target
• Al-30Sc Sputtering Target
• Al-40Sc Sputtering Target
• Custom AlSc Composition
• RF Sputtering Grade
• DC Sputtering Grade
• Magnetron Sputtering Grade
• Reactive Sputtering Grade
• Semiconductor-Grade AlSc
• MEMS-Grade Aluminum Scandium
• Piezoelectric Thin-Film Grade
• High-Density AlSc Target
• Bonded AlSc Sputtering Target
• Unbonded AlSc Sputtering Target
• Custom Aluminum Scandium Sputtering Target

1. What is an Aluminum Scandium Sputtering Target?

An Aluminum Scandium (AlSc) Sputtering Target is an aluminum-scandium metal alloy used as a sputtering source for depositing aluminum-scandium-containing thin films, particularly AlScN when sputtered in a nitrogen-containing atmosphere.

2. What is an AlSc sputtering target used for?

AlSc targets are primarily used for AlScN piezoelectric thin films, which have applications in 5G/6G RF filters, MEMS, BAW resonators, acoustic devices, sensors, actuators, and advanced semiconductor technologies.

3. What scandium concentrations are available?

Scandium concentration can be customized. Common compositions include 5, 10, 15, 20, 25, 30, and 40 at.% Sc, although other compositions can be sourced.

4. Is AlSc the same as AlScN?

No. AlSc is the metallic aluminum-scandium alloy target, while AlScN is aluminum scandium nitride, the resulting nitride thin-film material. AlSc targets can be reactively sputtered in a nitrogen-containing atmosphere to produce AlScN films.

5. Can AlSc targets be used for reactive sputtering?

Yes. Reactive magnetron sputtering of AlSc targets in an Ar/N₂ atmosphere is commonly used to deposit AlScN thin films.

6. Are AlSc targets available for DC sputtering?

Yes. Because AlSc is a metallic alloy, it can generally be used with DC or pulsed-DC magnetron sputtering, depending on the deposition system and target configuration.